Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste.

Ju YM, Kim TW, Lee SH, Lee HJ, Ahn J, Kim HS

DOI: 10.1186/s40580-025-00503-3
Published: 2025 Jul 23
Container: Nano convergence
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1186/s40580-025-00503-3,
  title = {Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste.},
  author = {Ju YM and Kim TW and Lee SH and Lee HJ and Ahn J and Kim HS},
  year = {2025},
  journal = {Nano convergence},
  doi = {10.1186/s40580-025-00503-3},
  url = {https://doi.org/10.1186/s40580-025-00503-3}
}

RIS

TY  - JOUR
TI  - Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste.
AU  - Ju YM
AU  - Kim TW
AU  - Lee SH
AU  - Lee HJ
AU  - Ahn J
AU  - Kim HS
PY  - 2025
JO  - Nano convergence
DO  - 10.1186/s40580-025-00503-3
UR  - https://doi.org/10.1186/s40580-025-00503-3
ER  -

APA

YM, J., TW, K., SH, L., HJ, L., J, A., & HS, K. (2025). Advanced WBG power semiconductor packaging: nanomaterials and nanotechnologies for high-performance die attach paste.. Nano convergence. https://doi.org/10.1186/s40580-025-00503-3

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pubmed · retrieved 2026-11-10T13:54:45.195Z