Solderjet bumping packaging technique optimization for the miniaturization of laser devices
- DOI
- 10.1186/s41476-017-0063-7
- Published
- 2017-11-06
- Container
- Journal of the European Optical Society-Rapid Publications
- Publisher
- EDP Sciences
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1186/s41476-017-0063-7,
title = {Solderjet bumping packaging technique optimization for the miniaturization of laser devices},
author = {P. Ribes-Pleguezuelo and B. Septriani and S. Zhang and E. Beckert and R. Eberhardt and F. Wyrowski and A. Tünnermann},
year = {2017},
journal = {Journal of the European Optical Society-Rapid Publications},
doi = {10.1186/s41476-017-0063-7},
url = {https://doi.org/10.1186/s41476-017-0063-7}
}RIS
TY - JOUR TI - Solderjet bumping packaging technique optimization for the miniaturization of laser devices AU - P. Ribes-Pleguezuelo AU - B. Septriani AU - S. Zhang AU - E. Beckert AU - R. Eberhardt AU - F. Wyrowski AU - A. Tünnermann PY - 2017 JO - Journal of the European Optical Society-Rapid Publications DO - 10.1186/s41476-017-0063-7 UR - https://doi.org/10.1186/s41476-017-0063-7 ER -
APA
Ribes-Pleguezuelo, P., Septriani, B., Zhang, S., Beckert, E., Eberhardt, R., Wyrowski, F., & Tünnermann, A. (2017). Solderjet bumping packaging technique optimization for the miniaturization of laser devices. Journal of the European Optical Society-Rapid Publications. https://doi.org/10.1186/s41476-017-0063-7
Source records
- crossref · retrieved 2026-11-08T18:38:00.721Z