Development of Resin-molding-releasing Metal Mold Surface Using Perfluoroalkyl Group-containing Polymer Plating.

Kunio MORI, Hidetoshi HIRAHARA, Yoshiyuki OISHI

Open source

DOI: 10.1246/nikkashi.2000.281
Published: 2000
Container: NIPPON KAGAKU KAISHI
Publisher: The Chemical Society of Japan
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1246/nikkashi.2000.281,
  title = {Development of Resin-molding-releasing Metal Mold Surface Using Perfluoroalkyl Group-containing Polymer Plating.},
  author = {Kunio MORI and Hidetoshi HIRAHARA and Yoshiyuki OISHI},
  year = {2000},
  journal = {NIPPON KAGAKU KAISHI},
  doi = {10.1246/nikkashi.2000.281},
  url = {https://doi.org/10.1246/nikkashi.2000.281}
}

RIS

TY  - JOUR
TI  - Development of Resin-molding-releasing Metal Mold Surface Using Perfluoroalkyl Group-containing Polymer Plating.
AU  - Kunio MORI
AU  - Hidetoshi HIRAHARA
AU  - Yoshiyuki OISHI
PY  - 2000
JO  - NIPPON KAGAKU KAISHI
DO  - 10.1246/nikkashi.2000.281
UR  - https://doi.org/10.1246/nikkashi.2000.281
ER  -

APA

MORI, K., HIRAHARA, H., & OISHI, Y. (2000). Development of Resin-molding-releasing Metal Mold Surface Using Perfluoroalkyl Group-containing Polymer Plating.. NIPPON KAGAKU KAISHI. https://doi.org/10.1246/nikkashi.2000.281

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crossref · retrieved 2026-09-27T02:13:44.662Z