Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation

Sakinah Mohd Yusof, Abdul Hadi, Junaidah Jai

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DOI: 10.12777/ijse.5.2.51-55
Published: 2013-10-15
Container: International Journal of Science and Engineering
Publisher: Faculty of Engineering Diponegoro University
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.12777/ijse.5.2.51-55,
  title = {Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation},
  author = {Sakinah Mohd Yusof and Abdul Hadi and Junaidah Jai},
  year = {2013},
  journal = {International Journal of Science and Engineering},
  doi = {10.12777/ijse.5.2.51-55},
  url = {https://doi.org/10.12777/ijse.5.2.51-55}
}

RIS

TY  - JOUR
TI  - Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation
AU  - Sakinah Mohd Yusof
AU  - Abdul Hadi
AU  - Junaidah Jai
PY  - 2013
JO  - International Journal of Science and Engineering
DO  - 10.12777/ijse.5.2.51-55
UR  - https://doi.org/10.12777/ijse.5.2.51-55
ER  -

APA

Yusof, S. M., Hadi, A., & Jai, J. (2013). Surface Morphology Study of Nanostructured Lead-Free Solder Alloy Sn-Ag-Cu Developed by Electrodeposition: Effect of Current Density Investigation. International Journal of Science and Engineering. https://doi.org/10.12777/ijse.5.2.51-55

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crossref · retrieved 2026-09-25T20:44:13.547Z