Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures

Noritake HIYOSHI

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DOI: 10.1299/mej.16-00081
Published: 5
Container: Mechanical Engineering Journal
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1299/mej.16-00081,
  title = {Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures},
  author = {Noritake HIYOSHI},
  year = {2016},
  journal = {Mechanical Engineering Journal},
  doi = {10.1299/mej.16-00081},
  url = {https://doi.org/10.1299/mej.16-00081}
}

RIS

TY  - JOUR
TI  - Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures
AU  - Noritake HIYOSHI
PY  - 2016
JO  - Mechanical Engineering Journal
DO  - 10.1299/mej.16-00081
UR  - https://doi.org/10.1299/mej.16-00081
ER  -

APA

HIYOSHI, N. (2016). Creep-fatigue life evaluation of Sn-3.5Ag lead-free solder at low temperatures. Mechanical Engineering Journal. https://doi.org/10.1299/mej.16-00081

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doaj · retrieved 2026-09-26T18:05:57.302Z