Optoelectronic co-simulation model for a 3D integrated structure with TSVs based on a micro-ring modulator and driver
- DOI
- 10.1364/ao.592624
- Published
- 2026-05-07
- Container
- Applied Optics
- Publisher
- Optica Publishing Group
- Open access
- unknown
Credibility signals
uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- supportingDOI registered: A matching record was returned by Crossref.
- supportingDOI resolves: A matching record was returned by Crossref.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredOpen access status: Not checked or no result supplied; no credibility inference made.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- not scoredPublication version: A publication version was supplied but is not scored.
- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.1364/ao.592624,
title = {Optoelectronic co-simulation model for a 3D integrated structure with TSVs based on a micro-ring modulator and driver},
author = {Dehua Dai and Shuxiao Wang and Yunfei Zhang and Jingyu Wei and Huanwen Zhang and Jingbo Shi and Yan Cai},
year = {2026},
journal = {Applied Optics},
doi = {10.1364/ao.592624},
url = {https://doi.org/10.1364/ao.592624}
}RIS
TY - JOUR TI - Optoelectronic co-simulation model for a 3D integrated structure with TSVs based on a micro-ring modulator and driver AU - Dehua Dai AU - Shuxiao Wang AU - Yunfei Zhang AU - Jingyu Wei AU - Huanwen Zhang AU - Jingbo Shi AU - Yan Cai PY - 2026 JO - Applied Optics DO - 10.1364/ao.592624 UR - https://doi.org/10.1364/ao.592624 ER -
APA
Dai, D., Wang, S., Zhang, Y., Wei, J., Zhang, H., Shi, J., & Cai, Y. (2026). Optoelectronic co-simulation model for a 3D integrated structure with TSVs based on a micro-ring modulator and driver. Applied Optics. https://doi.org/10.1364/ao.592624
Source records
- crossref · retrieved 2026-11-10T10:49:26.209Z