Three-dimensional X-ray imaging and reliability prediction of flip-chip interconnects in infrared focal plane arrays
- DOI
- 10.1364/oe.567588
- Published
- 2025-08-21
- Container
- Optics Express
- Publisher
- Optica Publishing Group
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1364/oe.567588,
title = {Three-dimensional X-ray imaging and reliability prediction of flip-chip interconnects in infrared focal plane arrays},
author = {Difei Zhang and Zetan Cao and Pingping Wen and Qingjun Liao and Changhong Sun and Jiacheng Gu and Jindong Wang and Xiaohui Xie and Huihao Li and Yan Chen and Boyong Wang and Yudong Yao and Wei Lu and Zhenhua Ye and Huaidong Jiang},
year = {2025},
journal = {Optics Express},
doi = {10.1364/oe.567588},
url = {https://doi.org/10.1364/oe.567588}
}RIS
TY - JOUR TI - Three-dimensional X-ray imaging and reliability prediction of flip-chip interconnects in infrared focal plane arrays AU - Difei Zhang AU - Zetan Cao AU - Pingping Wen AU - Qingjun Liao AU - Changhong Sun AU - Jiacheng Gu AU - Jindong Wang AU - Xiaohui Xie AU - Huihao Li AU - Yan Chen AU - Boyong Wang AU - Yudong Yao AU - Wei Lu AU - Zhenhua Ye AU - Huaidong Jiang PY - 2025 JO - Optics Express DO - 10.1364/oe.567588 UR - https://doi.org/10.1364/oe.567588 ER -
APA
Zhang, D., Cao, Z., Wen, P., Liao, Q., Sun, C., Gu, J., Wang, J., Xie, X., Li, H., Chen, Y., Wang, B., Yao, Y., Lu, W., Ye, Z., & Jiang, H. (2025). Three-dimensional X-ray imaging and reliability prediction of flip-chip interconnects in infrared focal plane arrays. Optics Express. https://doi.org/10.1364/oe.567588
Source records
- crossref · retrieved 2026-11-03T22:37:11.897Z