FWave: a fast 3D resist model with dual-branch architecture for EUV lithography simulation.

Zhang Y, Liu R, Tan J, Dong L, Wei Y

Open source

DOI
10.1364/oe.603845
Published
2026 Jul 13
Container
Optics express
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1364/oe.603845,
  title = {FWave: a fast 3D resist model with dual-branch architecture for EUV lithography simulation.},
  author = {Zhang Y and Liu R and Tan J and Dong L and Wei Y},
  year = {2026},
  journal = {Optics express},
  doi = {10.1364/oe.603845},
  url = {https://doi.org/10.1364/oe.603845}
}

RIS

TY  - JOUR
TI  - FWave: a fast 3D resist model with dual-branch architecture for EUV lithography simulation.
AU  - Zhang Y
AU  - Liu R
AU  - Tan J
AU  - Dong L
AU  - Wei Y
PY  - 2026
JO  - Optics express
DO  - 10.1364/oe.603845
UR  - https://doi.org/10.1364/oe.603845
ER  - 

APA

Y, Z., R, L., J, T., L, D., & Y, W. (2026). FWave: a fast 3D resist model with dual-branch architecture for EUV lithography simulation.. Optics express. https://doi.org/10.1364/oe.603845

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