Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe
- DOI
- 10.15282/jmes.9.2015.4.0152
- Published
- 2015-12-31
- Container
- Journal of Mechanical Engineering and Sciences
- Publisher
- Universiti Malaysia Pahang Al-Sultan Abdullah Press (UMPSA Press)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.15282/jmes.9.2015.4.0152,
title = {Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe},
author = {M.A. Azmah Hanim and A. Ourdjini and I. Siti Rabiatull Aisha and O. Saliza Azlina},
year = {2015},
journal = {Journal of Mechanical Engineering and Sciences},
doi = {10.15282/jmes.9.2015.4.0152},
url = {https://doi.org/10.15282/jmes.9.2015.4.0152}
}RIS
TY - JOUR TI - Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe AU - M.A. Azmah Hanim AU - A. Ourdjini AU - I. Siti Rabiatull Aisha AU - O. Saliza Azlina PY - 2015 JO - Journal of Mechanical Engineering and Sciences DO - 10.15282/jmes.9.2015.4.0152 UR - https://doi.org/10.15282/jmes.9.2015.4.0152 ER -
APA
Hanim, M. A., Ourdjini, A., Aisha, I. S. R., & Azlina, O. S. (2015). Thermal cyclic test for Sn-4Ag-0.5Cu solders on high P Ni/Au and Ni/Pd/Au surface finishe. Journal of Mechanical Engineering and Sciences. https://doi.org/10.15282/jmes.9.2015.4.0152
Source records
- crossref · retrieved 2026-09-26T18:41:40.972Z