Reducing a Thermal Resistance of a Thermoelectric Module by using Grooved Interlocking Plates.

Norio Nozaki, Tetuo Take, Toshiaki Yachi

Open source

DOI: 10.1541/ieejpes.123.194
Published: 2003
Container: IEEJ Transactions on Power and Energy
Publisher: Institute of Electrical Engineers of Japan (IEE Japan)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1541/ieejpes.123.194,
  title = {Reducing a Thermal Resistance of a Thermoelectric Module by using Grooved Interlocking Plates.},
  author = {Norio Nozaki and Tetuo Take and Toshiaki Yachi},
  year = {2003},
  journal = {IEEJ Transactions on Power and Energy},
  doi = {10.1541/ieejpes.123.194},
  url = {https://doi.org/10.1541/ieejpes.123.194}
}

RIS

TY  - JOUR
TI  - Reducing a Thermal Resistance of a Thermoelectric Module by using Grooved Interlocking Plates.
AU  - Norio Nozaki
AU  - Tetuo Take
AU  - Toshiaki Yachi
PY  - 2003
JO  - IEEJ Transactions on Power and Energy
DO  - 10.1541/ieejpes.123.194
UR  - https://doi.org/10.1541/ieejpes.123.194
ER  -

APA

Nozaki, N., Take, T., & Yachi, T. (2003). Reducing a Thermal Resistance of a Thermoelectric Module by using Grooved Interlocking Plates.. IEEJ Transactions on Power and Energy. https://doi.org/10.1541/ieejpes.123.194

Source records

crossref · retrieved 2026-09-27T10:50:09.567Z