Thermal microelectromechanical sensor construction

Egor Kiselev, Tetyana Krytska, Nina Stroiteleva, Konstantin Turyshev

Open source

DOI: 10.15587/1729-4061.2019.184443
Published: 2019-12-18
Container: Eastern-European Journal of Enterprise Technologies
Publisher: Private Company Technology Center
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.15587/1729-4061.2019.184443,
  title = {Thermal microelectromechanical sensor construction},
  author = {Egor Kiselev and Tetyana Krytska and Nina Stroiteleva and Konstantin Turyshev},
  year = {2019},
  journal = {Eastern-European Journal of Enterprise Technologies},
  doi = {10.15587/1729-4061.2019.184443},
  url = {https://doi.org/10.15587/1729-4061.2019.184443}
}

RIS

TY  - JOUR
TI  - Thermal microelectromechanical sensor construction
AU  - Egor Kiselev
AU  - Tetyana Krytska
AU  - Nina Stroiteleva
AU  - Konstantin Turyshev
PY  - 2019
JO  - Eastern-European Journal of Enterprise Technologies
DO  - 10.15587/1729-4061.2019.184443
UR  - https://doi.org/10.15587/1729-4061.2019.184443
ER  -

APA

Kiselev, E., Krytska, T., Stroiteleva, N., & Turyshev, K. (2019). Thermal microelectromechanical sensor construction. Eastern-European Journal of Enterprise Technologies. https://doi.org/10.15587/1729-4061.2019.184443

Source records

crossref · retrieved 2026-09-25T13:53:28.354Z