Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks

Xin L, Yeliang W.

DOI: 10.20944/preprints202510.0867.v1
Published: 2025-10-11
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Cite this work

BibTeX

@article{allodium:10.20944/preprints202510.0867.v1,
  title = {Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks},
  author = {Xin L and  Yeliang W.},
  year = {2025},
  doi = {10.20944/preprints202510.0867.v1},
  url = {https://doi.org/10.20944/preprints202510.0867.v1}
}

RIS

TY  - JOUR
TI  - Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks
AU  - Xin L
AU  -  Yeliang W.
PY  - 2025
DO  - 10.20944/preprints202510.0867.v1
UR  - https://doi.org/10.20944/preprints202510.0867.v1
ER  -

APA

L, X., & W., Y. (2025). Packaging-Aware EMC for 2.5D/3D Semiconductor Devices with Key-Point Radiated Checks. https://doi.org/10.20944/preprints202510.0867.v1

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europe-pmc · retrieved 2026-11-10T11:45:32.045Z