Layered Manufacturing of Nanocrystalline Copper Parts Using Pulse Jet Electrodeposition and its Mechanical Properties
- DOI
- 10.20964/2020.09.81
- Published
- 2020-09
- Container
- International Journal of Electrochemical Science
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.20964/2020.09.81,
title = {Layered Manufacturing of Nanocrystalline Copper Parts Using Pulse Jet Electrodeposition and its Mechanical Properties},
author = {Hui Fan and Yangpei Zhao and Jie Jiang and Shankui Wang and Zhijing Li},
year = {2020},
journal = {International Journal of Electrochemical Science},
doi = {10.20964/2020.09.81},
url = {https://doi.org/10.20964/2020.09.81}
}RIS
TY - JOUR TI - Layered Manufacturing of Nanocrystalline Copper Parts Using Pulse Jet Electrodeposition and its Mechanical Properties AU - Hui Fan AU - Yangpei Zhao AU - Jie Jiang AU - Shankui Wang AU - Zhijing Li PY - 2020 JO - International Journal of Electrochemical Science DO - 10.20964/2020.09.81 UR - https://doi.org/10.20964/2020.09.81 ER -
APA
Fan, H., Zhao, Y., Jiang, J., Wang, S., & Li, Z. (2020). Layered Manufacturing of Nanocrystalline Copper Parts Using Pulse Jet Electrodeposition and its Mechanical Properties. International Journal of Electrochemical Science. https://doi.org/10.20964/2020.09.81
Source records
- crossref · retrieved 2026-09-27T04:24:44.039Z