Quantitative Evaluation of Silicon Wafer Backside Morphology and Profilometric Roughness by Optical Imaging During TMAH/IPA-Induced Surface Smoothing
- DOI
- 10.21203/rs.3.rs-10113862/v1
- Published
- 2026-09-24
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- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.21203/rs.3.rs-10113862/v1,
title = {Quantitative Evaluation of Silicon Wafer Backside Morphology and Profilometric Roughness by Optical Imaging During TMAH/IPA-Induced Surface Smoothing},
author = {Taner FBA and vatansever A.},
year = {2026},
doi = {10.21203/rs.3.rs-10113862/v1},
url = {https://doi.org/10.21203/rs.3.rs-10113862/v1}
}RIS
TY - JOUR TI - Quantitative Evaluation of Silicon Wafer Backside Morphology and Profilometric Roughness by Optical Imaging During TMAH/IPA-Induced Surface Smoothing AU - Taner FBA AU - vatansever A. PY - 2026 DO - 10.21203/rs.3.rs-10113862/v1 UR - https://doi.org/10.21203/rs.3.rs-10113862/v1 ER -
APA
FBA, T., & A., V. (2026). Quantitative Evaluation of Silicon Wafer Backside Morphology and Profilometric Roughness by Optical Imaging During TMAH/IPA-Induced Surface Smoothing. https://doi.org/10.21203/rs.3.rs-10113862/v1
Source records
- europe-pmc · retrieved 2026-11-10T16:48:42.489Z