Conditional Generation of Overlapping Mixed-type Wafer Bin Map Defects via Feature-wise Linear Modulation

Choi J, Kim Y.

DOI: 10.21203/rs.3.rs-10356216/v1
Published: 2026-08-12
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Cite this work

BibTeX

@article{allodium:10.21203/rs.3.rs-10356216/v1,
  title = {Conditional Generation of Overlapping Mixed-type Wafer Bin Map Defects via Feature-wise Linear Modulation},
  author = {Choi J and  Kim Y.},
  year = {2026},
  doi = {10.21203/rs.3.rs-10356216/v1},
  url = {https://doi.org/10.21203/rs.3.rs-10356216/v1}
}

RIS

TY  - JOUR
TI  - Conditional Generation of Overlapping Mixed-type Wafer Bin Map Defects via Feature-wise Linear Modulation
AU  - Choi J
AU  -  Kim Y.
PY  - 2026
DO  - 10.21203/rs.3.rs-10356216/v1
UR  - https://doi.org/10.21203/rs.3.rs-10356216/v1
ER  -

APA

J, C., & Y., K. (2026). Conditional Generation of Overlapping Mixed-type Wafer Bin Map Defects via Feature-wise Linear Modulation. https://doi.org/10.21203/rs.3.rs-10356216/v1

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europe-pmc · retrieved 2026-09-26T00:44:48.178Z