Effect of non-thermal plasma treatment on the bonding property of Bio-HPP post and core materials

Jun-hong Lin, Lei Jiang, Yu-shan Zhu, Yong-jin Guo

Open source

DOI: 10.21203/rs.3.rs-10667395/v1
Published: 2026-09-02
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Publisher: Springer Science and Business Media LLC
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Cite this work

BibTeX

@article{allodium:10.21203/rs.3.rs-10667395/v1,
  title = {Effect of non-thermal plasma treatment on the bonding property of Bio-HPP post and core materials},
  author = {Jun-hong Lin and Lei Jiang and Yu-shan Zhu and Yong-jin Guo},
  year = {2026},
  doi = {10.21203/rs.3.rs-10667395/v1},
  url = {https://doi.org/10.21203/rs.3.rs-10667395/v1}
}

RIS

TY  - JOUR
TI  - Effect of non-thermal plasma treatment on the bonding property of Bio-HPP post and core materials
AU  - Jun-hong Lin
AU  - Lei Jiang
AU  - Yu-shan Zhu
AU  - Yong-jin Guo
PY  - 2026
DO  - 10.21203/rs.3.rs-10667395/v1
UR  - https://doi.org/10.21203/rs.3.rs-10667395/v1
ER  -

APA

Lin, J., Jiang, L., Zhu, Y., & Guo, Y. (2026). Effect of non-thermal plasma treatment on the bonding property of Bio-HPP post and core materials. https://doi.org/10.21203/rs.3.rs-10667395/v1

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crossref · retrieved 2026-09-26T14:35:11.234Z