Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing

Mai NH.

DOI: 10.21203/rs.3.rs-10941893/v1
Published: 2026-09-09
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Cite this work

BibTeX

@article{allodium:10.21203/rs.3.rs-10941893/v1,
  title = {Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing},
  author = {Mai NH.},
  year = {2026},
  doi = {10.21203/rs.3.rs-10941893/v1},
  url = {https://doi.org/10.21203/rs.3.rs-10941893/v1}
}

RIS

TY  - JOUR
TI  - Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing
AU  - Mai NH.
PY  - 2026
DO  - 10.21203/rs.3.rs-10941893/v1
UR  - https://doi.org/10.21203/rs.3.rs-10941893/v1
ER  -

APA

NH., M. (2026). Digital Lean Six Sigma Across Vietnam's Electronics-Semiconductor Manufacturing Chain: Longitudinal Evidence from High-Mix Semiconductor-Equipment Contract Manufacturing. https://doi.org/10.21203/rs.3.rs-10941893/v1

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europe-pmc · retrieved 2026-09-27T05:03:10.100Z