Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications

Alsowidy S, Aljarbani AM, Gumaan MS.

DOI: 10.21203/rs.3.rs-227856/v1
Published: 2021-02-23
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Cite this work

BibTeX

@article{allodium:10.21203/rs.3.rs-227856/v1,
  title = {Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications},
  author = {Alsowidy S and  Aljarbani AM and  Gumaan MS.},
  year = {2021},
  doi = {10.21203/rs.3.rs-227856/v1},
  url = {https://doi.org/10.21203/rs.3.rs-227856/v1}
}

RIS

TY  - JOUR
TI  - Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications
AU  - Alsowidy S
AU  -  Aljarbani AM
AU  -  Gumaan MS.
PY  - 2021
DO  - 10.21203/rs.3.rs-227856/v1
UR  - https://doi.org/10.21203/rs.3.rs-227856/v1
ER  -

APA

S, A., AM, A., & MS., G. (2021). Microstructural and Creep Characterization of Sn-0.7Cu and Sn-0.7Cu-xBi Lead-free Solders for Low Cost Electronic Applications. https://doi.org/10.21203/rs.3.rs-227856/v1

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europe-pmc · retrieved 2026-09-26T14:32:05.217Z