Electro-Thermal and Thermal-Stress Coupling Optimization Design for Coaxial Through Silicon Via

Xianglong Wang, Yintang Yang, Dongdong Chen, Di Li, Gaoliang Li

Open source

DOI: 10.21203/rs.3.rs-2789242/v1
Published: 2024-01-09
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Publisher: Research Square Platform LLC
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Cite this work

BibTeX

@article{allodium:10.21203/rs.3.rs-2789242/v1,
  title = {Electro-Thermal and Thermal-Stress Coupling Optimization Design for Coaxial Through Silicon Via},
  author = {Xianglong Wang and Yintang Yang and Dongdong Chen and Di Li and Gaoliang Li},
  year = {2024},
  doi = {10.21203/rs.3.rs-2789242/v1},
  url = {https://doi.org/10.21203/rs.3.rs-2789242/v1}
}

RIS

TY  - JOUR
TI  - Electro-Thermal and Thermal-Stress Coupling Optimization Design for Coaxial Through Silicon Via
AU  - Xianglong Wang
AU  - Yintang Yang
AU  - Dongdong Chen
AU  - Di Li
AU  - Gaoliang Li
PY  - 2024
DO  - 10.21203/rs.3.rs-2789242/v1
UR  - https://doi.org/10.21203/rs.3.rs-2789242/v1
ER  -

APA

Wang, X., Yang, Y., Chen, D., Li, D., & Li, G. (2024). Electro-Thermal and Thermal-Stress Coupling Optimization Design for Coaxial Through Silicon Via. https://doi.org/10.21203/rs.3.rs-2789242/v1

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crossref · retrieved 2026-11-10T13:58:41.656Z