Room-Temperature and Atmospheric-Pressure Direct Wafer Bonding without Stringent Pretreatments Using Ultrafast Lasers
- DOI
- 10.21203/rs.3.rs-9881361/v1
- Published
- 2026-06-02
- Container
- Not recorded
- Publisher
- Springer Science and Business Media LLC
- Open access
- unknown
Credibility signals
uncertain Score 60/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.
Show all credibility signals
- supportingDOI registered: A matching record was returned by Crossref.
- supportingDOI resolves: A matching record was returned by Crossref.
- not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility.
- not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made.
- not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made.
- not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made.
- not scoredROR affiliation: Not checked or no result supplied; no credibility inference made.
- not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete.
- not scoredOpen access status: Not checked or no result supplied; no credibility inference made.
- not scoredPublication license: Not checked or no result supplied; no credibility inference made.
- cautionPublication version: Identified as a preprint; peer review and later versions may change the record.
- supportingMetadata completeness: All 6 scored descriptive metadata groups are present.
Cite this work
BibTeX
@article{allodium:10.21203/rs.3.rs-9881361/v1,
title = {Room-Temperature and Atmospheric-Pressure Direct Wafer Bonding without Stringent Pretreatments Using Ultrafast Lasers},
author = {Xianlong Wei and Taoyuan Zhu and Zhenyu Hu and Qiaohui Yang and Yuqiang Yu and Ruixue Ding and Weilong Wu and Bingjie Wang and Duo Pan and Jingbiao Chen and Zhiwei Li},
year = {2026},
doi = {10.21203/rs.3.rs-9881361/v1},
url = {https://doi.org/10.21203/rs.3.rs-9881361/v1}
}RIS
TY - JOUR TI - Room-Temperature and Atmospheric-Pressure Direct Wafer Bonding without Stringent Pretreatments Using Ultrafast Lasers AU - Xianlong Wei AU - Taoyuan Zhu AU - Zhenyu Hu AU - Qiaohui Yang AU - Yuqiang Yu AU - Ruixue Ding AU - Weilong Wu AU - Bingjie Wang AU - Duo Pan AU - Jingbiao Chen AU - Zhiwei Li PY - 2026 DO - 10.21203/rs.3.rs-9881361/v1 UR - https://doi.org/10.21203/rs.3.rs-9881361/v1 ER -
APA
Wei, X., Zhu, T., Hu, Z., Yang, Q., Yu, Y., Ding, R., Wu, W., Wang, B., Pan, D., Chen, J., & Li, Z. (2026). Room-Temperature and Atmospheric-Pressure Direct Wafer Bonding without Stringent Pretreatments Using Ultrafast Lasers. https://doi.org/10.21203/rs.3.rs-9881361/v1
Source records
- crossref · retrieved 2026-09-26T01:02:24.345Z