Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates

Soares D., Vilarinho C., Barbosa J., Samuel F., Trigo L., Bré P.

Open source

DOI: 10.2298/jmmb0702131s
Published: 2007
Container: Journal of Mining and Metallurgy. Section B: Metallurgy
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.2298/jmmb0702131s,
  title = {Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates},
  author = {Soares D. and Vilarinho C. and Barbosa J. and Samuel F. and Trigo L. and Bré P.},
  year = {2007},
  journal = {Journal of Mining and Metallurgy. Section B: Metallurgy},
  doi = {10.2298/jmmb0702131s},
  url = {https://doi.org/10.2298/jmmb0702131s}
}

RIS

TY  - JOUR
TI  - Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates
AU  - Soares D.
AU  - Vilarinho C.
AU  - Barbosa J.
AU  - Samuel F.
AU  - Trigo L.
AU  - Bré P.
PY  - 2007
JO  - Journal of Mining and Metallurgy. Section B: Metallurgy
DO  - 10.2298/jmmb0702131s
UR  - https://doi.org/10.2298/jmmb0702131s
ER  -

APA

D., S., C., V., J., B., F., S., L., T., & P., B. (2007). Effect of trace elements on the interface reactions between two lead-free solders and copper or nickel substrates. Journal of Mining and Metallurgy. Section B: Metallurgy. https://doi.org/10.2298/jmmb0702131s

Source records

doaj · retrieved 2026-09-26T18:33:49.791Z