Assembly of very fine pitches Infrared focal plane array with indium micro balls

O. MAILLIART, S. RENET, F. BERGER, A. GUEUGNOT, S. BISOTTO, S. GOUT, L. MATHIEU, Y. GOIRAN, T. CHAIRA

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DOI: 10.23919/empc44848.2019.8951830
Published: 2019-09
Container: 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher: IEEE
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.23919/empc44848.2019.8951830,
  title = {Assembly of very fine pitches Infrared focal plane array with indium micro balls},
  author = {O. MAILLIART and S. RENET and F. BERGER and A. GUEUGNOT and S. BISOTTO and S. GOUT and L. MATHIEU and Y. GOIRAN and T. CHAIRA},
  year = {2019},
  journal = {2019 22nd European Microelectronics and Packaging Conference \&amp; Exhibition (EMPC)},
  doi = {10.23919/empc44848.2019.8951830},
  url = {https://doi.org/10.23919/empc44848.2019.8951830}
}

RIS

TY  - JOUR
TI  - Assembly of very fine pitches Infrared focal plane array with indium micro balls
AU  - O. MAILLIART
AU  - S. RENET
AU  - F. BERGER
AU  - A. GUEUGNOT
AU  - S. BISOTTO
AU  - S. GOUT
AU  - L. MATHIEU
AU  - Y. GOIRAN
AU  - T. CHAIRA
PY  - 2019
JO  - 2019 22nd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)
DO  - 10.23919/empc44848.2019.8951830
UR  - https://doi.org/10.23919/empc44848.2019.8951830
ER  -

APA

MAILLIART, O., RENET, S., BERGER, F., GUEUGNOT, A., BISOTTO, S., GOUT, S., MATHIEU, L., GOIRAN, Y., & CHAIRA, T. (2019). Assembly of very fine pitches Infrared focal plane array with indium micro balls. 2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC). https://doi.org/10.23919/empc44848.2019.8951830

Source records

crossref · retrieved 2026-09-25T16:41:49.233Z