Development of innovative substrate and embedding technologies for high frequency applications

Dionysios Manessis, Stefan Kosmider, Lars Boettcher, Manuel Seckel, Kavin Murugesan, Uwe Maas, Ivan Ndip, Andreas Ostmann, Rolf Aschenbrenner, Martin Schneider-Ramelow, K-D. Lang

Open source

DOI: 10.23919/empc53418.2021.9584975
Published: 2021-09-13
Container: 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Publisher: IEEE
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.23919/empc53418.2021.9584975,
  title = {Development of innovative substrate and embedding technologies for high frequency applications},
  author = {Dionysios Manessis and Stefan Kosmider and Lars Boettcher and Manuel Seckel and Kavin Murugesan and Uwe Maas and Ivan Ndip and Andreas Ostmann and Rolf Aschenbrenner and Martin Schneider-Ramelow and K-D. Lang},
  year = {2021},
  journal = {2021 23rd European Microelectronics and Packaging Conference \&amp; Exhibition (EMPC)},
  doi = {10.23919/empc53418.2021.9584975},
  url = {https://doi.org/10.23919/empc53418.2021.9584975}
}

RIS

TY  - JOUR
TI  - Development of innovative substrate and embedding technologies for high frequency applications
AU  - Dionysios Manessis
AU  - Stefan Kosmider
AU  - Lars Boettcher
AU  - Manuel Seckel
AU  - Kavin Murugesan
AU  - Uwe Maas
AU  - Ivan Ndip
AU  - Andreas Ostmann
AU  - Rolf Aschenbrenner
AU  - Martin Schneider-Ramelow
AU  - K-D. Lang
PY  - 2021
JO  - 2021 23rd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)
DO  - 10.23919/empc53418.2021.9584975
UR  - https://doi.org/10.23919/empc53418.2021.9584975
ER  -

APA

Manessis, D., Kosmider, S., Boettcher, L., Seckel, M., Murugesan, K., Maas, U., Ndip, I., Ostmann, A., Aschenbrenner, R., Schneider-Ramelow, M., & Lang, K. (2021). Development of innovative substrate and embedding technologies for high frequency applications. 2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC). https://doi.org/10.23919/empc53418.2021.9584975

Source records

crossref · retrieved 2026-11-10T11:38:02.278Z