Multiscale Micromechanical Study of Polymer Core Solder Ball for BGA Interconnections Reliability

S. Sao Joao, I. Malkorra, U. Costa, D. Chalavoux, S. Bucher, N. Perardel, G. Kermouche

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DOI: 10.23919/icep-iaac64884.2025.11002932
Published: 2025-04-15
Container: 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
Publisher: IEEE
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.23919/icep-iaac64884.2025.11002932,
  title = {Multiscale Micromechanical Study of Polymer Core Solder Ball for BGA Interconnections Reliability},
  author = {S. Sao Joao and I. Malkorra and U. Costa and D. Chalavoux and S. Bucher and N. Perardel and G. Kermouche},
  year = {2025},
  journal = {2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)},
  doi = {10.23919/icep-iaac64884.2025.11002932},
  url = {https://doi.org/10.23919/icep-iaac64884.2025.11002932}
}

RIS

TY  - JOUR
TI  - Multiscale Micromechanical Study of Polymer Core Solder Ball for BGA Interconnections Reliability
AU  - S. Sao Joao
AU  - I. Malkorra
AU  - U. Costa
AU  - D. Chalavoux
AU  - S. Bucher
AU  - N. Perardel
AU  - G. Kermouche
PY  - 2025
JO  - 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC)
DO  - 10.23919/icep-iaac64884.2025.11002932
UR  - https://doi.org/10.23919/icep-iaac64884.2025.11002932
ER  -

APA

Joao, S. S., Malkorra, I., Costa, U., Chalavoux, D., Bucher, S., Perardel, N., & Kermouche, G. (2025). Multiscale Micromechanical Study of Polymer Core Solder Ball for BGA Interconnections Reliability. 2025 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC). https://doi.org/10.23919/icep-iaac64884.2025.11002932

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crossref · retrieved 2026-09-27T00:47:32.096Z