Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells - Status and Outlook

Eckert, Jonas, Kluska, Sven, Haberstroh, René, Schmiga, Christian, Mack, Sebastian, Kamp, Mathias, Brunner, Damian, Nekarda, Jan, Clement, Florian, :unav

Open source

DOI: 10.24406/publica-7853
Published: 2026
Container: Not recorded
Publisher: Fraunhofer-Gesellschaft
Open access: no

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Cite this work

BibTeX

@article{allodium:10.24406/publica-7853,
  title = {Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells - Status and Outlook},
  author = {Eckert, Jonas and Kluska, Sven and Haberstroh, René and Schmiga, Christian and Mack, Sebastian and Kamp, Mathias and Brunner, Damian and Nekarda, Jan and Clement, Florian and :unav},
  year = {2026},
  doi = {10.24406/publica-7853},
  url = {https://doi.org/10.24406/publica-7853}
}

RIS

TY  - JOUR
TI  - Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells - Status and Outlook
AU  - Eckert, Jonas
AU  - Kluska, Sven
AU  - Haberstroh, René
AU  - Schmiga, Christian
AU  - Mack, Sebastian
AU  - Kamp, Mathias
AU  - Brunner, Damian
AU  - Nekarda, Jan
AU  - Clement, Florian
AU  - :unav
PY  - 2026
DO  - 10.24406/publica-7853
UR  - https://doi.org/10.24406/publica-7853
ER  -

APA

Jonas, E., Sven, K., René, H., Christian, S., Sebastian, M., Mathias, K., Damian, B., Jan, N., Florian, C., & :unav (2026). Inline Plating of Ni/Cu Contacts for Industrial TOPCon Si Solar Cells - Status and Outlook. https://doi.org/10.24406/publica-7853

Source records

datacite · retrieved 2026-09-25T16:59:10.291Z