Investigation of the Effect of Fin Geometry on the Thermal Performance of Microelectronic Devices

Sana J. Yaseen, Ali K. Hadi, Ali A. Abed, Abdel-Nasser Sharkawy

Open source

DOI: 10.24423/engtrans.2026.3700
Published: 9
Container: Engineering Transactions
Publisher: Not recorded
Open access: yes

Credibility signals

uncertain Score 53/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

cautionDOI registered: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
cautionDOI resolves: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
supportingDirectory of Open Access Journals: A matching record was returned by DOAJ. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
supportingOpen access status: Normalized open-access status: open. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.24423/engtrans.2026.3700,
  title = {Investigation of the Effect of Fin Geometry on the Thermal Performance of Microelectronic Devices},
  author = {Sana J. Yaseen and Ali K.  Hadi and Ali A.  Abed and Abdel-Nasser Sharkawy},
  year = {2026},
  journal = {Engineering Transactions},
  doi = {10.24423/engtrans.2026.3700},
  url = {https://doi.org/10.24423/engtrans.2026.3700}
}

RIS

TY  - JOUR
TI  - Investigation of the Effect of Fin Geometry on the Thermal Performance of Microelectronic Devices
AU  - Sana J. Yaseen
AU  - Ali K.  Hadi
AU  - Ali A.  Abed
AU  - Abdel-Nasser Sharkawy
PY  - 2026
JO  - Engineering Transactions
DO  - 10.24423/engtrans.2026.3700
UR  - https://doi.org/10.24423/engtrans.2026.3700
ER  -

APA

Yaseen, S. J., Hadi, A. K., Abed, A. A., & Sharkawy, A. (2026). Investigation of the Effect of Fin Geometry on the Thermal Performance of Microelectronic Devices. Engineering Transactions. https://doi.org/10.24423/engtrans.2026.3700

Source records

doaj · retrieved 2026-09-25T03:08:01.237Z