The influence of annealing (900◦C) of ultra-thin PECVD silicon oxynitride layers

Robert Mroczyński, Grzegorz Głuszko, Romuald B. Beck, Andrzej Jakubowski, Michał Ćwil, Piotr Konarski, Patrick Hoffmann, Dieter Schmeißer

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DOI
10.26636/jtit.2007.3.821
Published
2007-09-30
Container
Journal of Telecommunications and Information Technology
Publisher
National Institute of Telecommunications
Open access
unknown

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BibTeX

@article{allodium:10.26636/jtit.2007.3.821,
  title = {The influence of annealing (900◦C) of ultra-thin PECVD silicon oxynitride layers},
  author = {Robert Mroczyński and Grzegorz Głuszko and Romuald B. Beck and Andrzej Jakubowski and Michał Ćwil and Piotr Konarski and Patrick Hoffmann and Dieter Schmeißer},
  year = {2007},
  journal = {Journal of Telecommunications and Information Technology},
  doi = {10.26636/jtit.2007.3.821},
  url = {https://doi.org/10.26636/jtit.2007.3.821}
}

RIS

TY  - JOUR
TI  - The influence of annealing (900◦C) of ultra-thin PECVD silicon oxynitride layers
AU  - Robert Mroczyński
AU  - Grzegorz Głuszko
AU  - Romuald B. Beck
AU  - Andrzej Jakubowski
AU  - Michał Ćwil
AU  - Piotr Konarski
AU  - Patrick Hoffmann
AU  - Dieter Schmeißer
PY  - 2007
JO  - Journal of Telecommunications and Information Technology
DO  - 10.26636/jtit.2007.3.821
UR  - https://doi.org/10.26636/jtit.2007.3.821
ER  - 

APA

Mroczyński, R., Głuszko, G., Beck, R. B., Jakubowski, A., Ćwil, M., Konarski, P., Hoffmann, P., & Schmeißer, D. (2007). The influence of annealing (900◦C) of ultra-thin PECVD silicon oxynitride layers. Journal of Telecommunications and Information Technology. https://doi.org/10.26636/jtit.2007.3.821

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