On the reliability of non-hermetically encapsulated ceramic printed circuit boards as bridging elements in neural implants

Julien Martens, Lukas Henneken, Alexandra Zehr, Cemre Otyakmazoglu, Paul Čvančara, Thomas Stieglitz

Open source

DOI: 10.3389/fnins.2026.1911095
Published: 2026-08-21
Container: Frontiers in Neuroscience
Publisher: Frontiers Media SA
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3389/fnins.2026.1911095,
  title = {On the reliability of non-hermetically encapsulated ceramic printed circuit boards as bridging elements in neural implants},
  author = {Julien Martens and Lukas Henneken and Alexandra Zehr and Cemre Otyakmazoglu and Paul Čvančara and Thomas Stieglitz},
  year = {2026},
  journal = {Frontiers in Neuroscience},
  doi = {10.3389/fnins.2026.1911095},
  url = {https://doi.org/10.3389/fnins.2026.1911095}
}

RIS

TY  - JOUR
TI  - On the reliability of non-hermetically encapsulated ceramic printed circuit boards as bridging elements in neural implants
AU  - Julien Martens
AU  - Lukas Henneken
AU  - Alexandra Zehr
AU  - Cemre Otyakmazoglu
AU  - Paul Čvančara
AU  - Thomas Stieglitz
PY  - 2026
JO  - Frontiers in Neuroscience
DO  - 10.3389/fnins.2026.1911095
UR  - https://doi.org/10.3389/fnins.2026.1911095
ER  -

APA

Martens, J., Henneken, L., Zehr, A., Otyakmazoglu, C., Čvančara, P., & Stieglitz, T. (2026). On the reliability of non-hermetically encapsulated ceramic printed circuit boards as bridging elements in neural implants. Frontiers in Neuroscience. https://doi.org/10.3389/fnins.2026.1911095

Source records

crossref · retrieved 2026-09-25T13:15:43.659Z