Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin.

Kim H, Song JI, Seo JW, Ko C, Seo GH, Han SK

DOI: 10.3390/bioengineering12060560
Published: 2025 May 23
Container: Bioengineering (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/bioengineering12060560,
  title = {Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin.},
  author = {Kim H and Song JI and Seo JW and Ko C and Seo GH and Han SK},
  year = {2025},
  journal = {Bioengineering (Basel, Switzerland)},
  doi = {10.3390/bioengineering12060560},
  url = {https://doi.org/10.3390/bioengineering12060560}
}

RIS

TY  - JOUR
TI  - Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin.
AU  - Kim H
AU  - Song JI
AU  - Seo JW
AU  - Ko C
AU  - Seo GH
AU  - Han SK
PY  - 2025
JO  - Bioengineering (Basel, Switzerland)
DO  - 10.3390/bioengineering12060560
UR  - https://doi.org/10.3390/bioengineering12060560
ER  -

APA

H, K., JI, S., JW, S., C, K., GH, S., & SK, H. (2025). Digitalized Thermal Inspection Method of the Low-Frequency Stimulation Pads for Preventing Low-Temperature Burn in Sensitive Skin.. Bioengineering (Basel, Switzerland). https://doi.org/10.3390/bioengineering12060560

Source records

pubmed · retrieved 2026-09-24T23:07:07.754Z