Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current
- DOI
- 10.3390/cryst16020127
- Published
- 2026-02-09
- Container
- Crystals
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/cryst16020127,
title = {Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current},
author = {Bo Wang and Peiying Zhu and Guopei Zhang and Chunyuan Deng and Kaixuan He and Wei Huang and Kailin Pan},
year = {2026},
journal = {Crystals},
doi = {10.3390/cryst16020127},
url = {https://doi.org/10.3390/cryst16020127}
}RIS
TY - JOUR TI - Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current AU - Bo Wang AU - Peiying Zhu AU - Guopei Zhang AU - Chunyuan Deng AU - Kaixuan He AU - Wei Huang AU - Kailin Pan PY - 2026 JO - Crystals DO - 10.3390/cryst16020127 UR - https://doi.org/10.3390/cryst16020127 ER -
APA
Wang, B., Zhu, P., Zhang, G., Deng, C., He, K., Huang, W., & Pan, K. (2026). Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current. Crystals. https://doi.org/10.3390/cryst16020127
Source records
- crossref · retrieved 2026-09-25T22:35:19.674Z