Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current

Bo Wang, Peiying Zhu, Guopei Zhang, Chunyuan Deng, Kaixuan He, Wei Huang, Kailin Pan

Open source

DOI
10.3390/cryst16020127
Published
2026-02-09
Container
Crystals
Publisher
MDPI AG
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.3390/cryst16020127,
  title = {Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current},
  author = {Bo Wang and Peiying Zhu and Guopei Zhang and Chunyuan Deng and Kaixuan He and Wei Huang and Kailin Pan},
  year = {2026},
  journal = {Crystals},
  doi = {10.3390/cryst16020127},
  url = {https://doi.org/10.3390/cryst16020127}
}

RIS

TY  - JOUR
TI  - Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current
AU  - Bo Wang
AU  - Peiying Zhu
AU  - Guopei Zhang
AU  - Chunyuan Deng
AU  - Kaixuan He
AU  - Wei Huang
AU  - Kailin Pan
PY  - 2026
JO  - Crystals
DO  - 10.3390/cryst16020127
UR  - https://doi.org/10.3390/cryst16020127
ER  - 

APA

Wang, B., Zhu, P., Zhang, G., Deng, C., He, K., Huang, W., & Pan, K. (2026). Study on the IMC Growth Mechanism of Cu/Sn-58Bi/Cu Joint Under Electromigration with Alternating Current. Crystals. https://doi.org/10.3390/cryst16020127

Source records