Degradation Factors and Mechanisms of Silicone Gel in Power Device Packaging Insulation Under DC Superimposed Pulse Electric Fields.

Wu Z, He D

DOI: 10.3390/gels12040274
Published: 2026 Mar 26
Container: Gels (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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BibTeX

@article{allodium:10.3390/gels12040274,
  title = {Degradation Factors and Mechanisms of Silicone Gel in Power Device Packaging Insulation Under DC Superimposed Pulse Electric Fields.},
  author = {Wu Z and He D},
  year = {2026},
  journal = {Gels (Basel, Switzerland)},
  doi = {10.3390/gels12040274},
  url = {https://doi.org/10.3390/gels12040274}
}

RIS

TY  - JOUR
TI  - Degradation Factors and Mechanisms of Silicone Gel in Power Device Packaging Insulation Under DC Superimposed Pulse Electric Fields.
AU  - Wu Z
AU  - He D
PY  - 2026
JO  - Gels (Basel, Switzerland)
DO  - 10.3390/gels12040274
UR  - https://doi.org/10.3390/gels12040274
ER  -

APA

Z, W., & D, H. (2026). Degradation Factors and Mechanisms of Silicone Gel in Power Device Packaging Insulation Under DC Superimposed Pulse Electric Fields.. Gels (Basel, Switzerland). https://doi.org/10.3390/gels12040274

Source records

pubmed · retrieved 2026-09-26T05:40:16.694Z