Research on Adhesion Performance of Silicone Gel for Power Module Packaging Regulated by Crosslink Structure and Interfacial Connection.

An X, He D, Zheng X, Li T, Zhang C, Liu H

Open source

DOI
10.3390/gels12070647
Published
2026 Jul 19
Container
Gels (Basel, Switzerland)
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.3390/gels12070647,
  title = {Research on Adhesion Performance of Silicone Gel for Power Module Packaging Regulated by Crosslink Structure and Interfacial Connection.},
  author = {An X and He D and Zheng X and Li T and Zhang C and Liu H},
  year = {2026},
  journal = {Gels (Basel, Switzerland)},
  doi = {10.3390/gels12070647},
  url = {https://doi.org/10.3390/gels12070647}
}

RIS

TY  - JOUR
TI  - Research on Adhesion Performance of Silicone Gel for Power Module Packaging Regulated by Crosslink Structure and Interfacial Connection.
AU  - An X
AU  - He D
AU  - Zheng X
AU  - Li T
AU  - Zhang C
AU  - Liu H
PY  - 2026
JO  - Gels (Basel, Switzerland)
DO  - 10.3390/gels12070647
UR  - https://doi.org/10.3390/gels12070647
ER  -

APA

X, A., D, H., X, Z., T, L., C, Z., & H, L. (2026). Research on Adhesion Performance of Silicone Gel for Power Module Packaging Regulated by Crosslink Structure and Interfacial Connection.. Gels (Basel, Switzerland). https://doi.org/10.3390/gels12070647

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