Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics.

Ding Y, Dou Y, Bai L, Li Z, Qi J, Li Y, Tan S, Zhang X, Sun J, Song Y, Wu J, Han F, Li Y

Open source

DOI
10.3390/gels12090822
Published
2026 Sep 7
Container
Gels (Basel, Switzerland)
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.3390/gels12090822,
  title = {Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics.},
  author = {Ding Y and Dou Y and Bai L and Li Z and Qi J and Li Y and Tan S and Zhang X and Sun J and Song Y and Wu J and Han F and Li Y},
  year = {2026},
  journal = {Gels (Basel, Switzerland)},
  doi = {10.3390/gels12090822},
  url = {https://doi.org/10.3390/gels12090822}
}

RIS

TY  - JOUR
TI  - Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics.
AU  - Ding Y
AU  - Dou Y
AU  - Bai L
AU  - Li Z
AU  - Qi J
AU  - Li Y
AU  - Tan S
AU  - Zhang X
AU  - Sun J
AU  - Song Y
AU  - Wu J
AU  - Han F
AU  - Li Y
PY  - 2026
JO  - Gels (Basel, Switzerland)
DO  - 10.3390/gels12090822
UR  - https://doi.org/10.3390/gels12090822
ER  - 

APA

Y, D., Y, D., L, B., Z, L., J, Q., Y, L., S, T., X, Z., J, S., Y, S., J, W., F, H., & Y, L. (2026). Strain-Insensitive Conductive Hydrogel Materials for Motion-Artifact-Free Flexible Bioelectronics.. Gels (Basel, Switzerland). https://doi.org/10.3390/gels12090822

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