Copper Peroxide-Loaded Dual-Responsive Hydrogel for Enhanced Diabetic Wound Healing Through Oxygen Release and Promotion of Angiogenesis
- DOI
- 10.3390/gels12100864
- Published
- 2026-09-24
- Container
- Gels
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/gels12100864,
title = {Copper Peroxide-Loaded Dual-Responsive Hydrogel for Enhanced Diabetic Wound Healing Through Oxygen Release and Promotion of Angiogenesis},
author = {Lanqin Yu and Xiang Jia and Lejia Xu and Xiaojun Li and Na Li and Lihua Li and Yifan Zhang and Changren Zhou},
year = {2026},
journal = {Gels},
doi = {10.3390/gels12100864},
url = {https://doi.org/10.3390/gels12100864}
}RIS
TY - JOUR TI - Copper Peroxide-Loaded Dual-Responsive Hydrogel for Enhanced Diabetic Wound Healing Through Oxygen Release and Promotion of Angiogenesis AU - Lanqin Yu AU - Xiang Jia AU - Lejia Xu AU - Xiaojun Li AU - Na Li AU - Lihua Li AU - Yifan Zhang AU - Changren Zhou PY - 2026 JO - Gels DO - 10.3390/gels12100864 UR - https://doi.org/10.3390/gels12100864 ER -
APA
Yu, L., Jia, X., Xu, L., Li, X., Li, N., Li, L., Zhang, Y., & Zhou, C. (2026). Copper Peroxide-Loaded Dual-Responsive Hydrogel for Enhanced Diabetic Wound Healing Through Oxygen Release and Promotion of Angiogenesis. Gels. https://doi.org/10.3390/gels12100864
Source records
- crossref · retrieved 2026-11-10T10:21:29.267Z