Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys

Wenchao Yang, Jidong Li, Yitai Li, Junli Feng, Jingwu Wu, Xiankun Zhou, Aihua Yu, Jiahui Wang, Siyu Liang, Mei Wei, Yongzhong Zhan

Open source

DOI
10.3390/ma12071194
Published
2019-04-11
Container
Materials
Publisher
MDPI AG
Open access
unknown

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BibTeX

@article{allodium:10.3390/ma12071194,
  title = {Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys},
  author = {Wenchao Yang and Jidong Li and Yitai Li and Junli Feng and Jingwu Wu and Xiankun Zhou and Aihua Yu and Jiahui Wang and Siyu Liang and Mei Wei and Yongzhong Zhan},
  year = {2019},
  journal = {Materials},
  doi = {10.3390/ma12071194},
  url = {https://doi.org/10.3390/ma12071194}
}

RIS

TY  - JOUR
TI  - Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys
AU  - Wenchao Yang
AU  - Jidong Li
AU  - Yitai Li
AU  - Junli Feng
AU  - Jingwu Wu
AU  - Xiankun Zhou
AU  - Aihua Yu
AU  - Jiahui Wang
AU  - Siyu Liang
AU  - Mei Wei
AU  - Yongzhong Zhan
PY  - 2019
JO  - Materials
DO  - 10.3390/ma12071194
UR  - https://doi.org/10.3390/ma12071194
ER  - 

APA

Yang, W., Li, J., Li, Y., Feng, J., Wu, J., Zhou, X., Yu, A., Wang, J., Liang, S., Wei, M., & Zhan, Y. (2019). Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials. https://doi.org/10.3390/ma12071194

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