Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys
- DOI
- 10.3390/ma12071194
- Published
- 2019-04-11
- Container
- Materials
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/ma12071194,
title = {Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys},
author = {Wenchao Yang and Jidong Li and Yitai Li and Junli Feng and Jingwu Wu and Xiankun Zhou and Aihua Yu and Jiahui Wang and Siyu Liang and Mei Wei and Yongzhong Zhan},
year = {2019},
journal = {Materials},
doi = {10.3390/ma12071194},
url = {https://doi.org/10.3390/ma12071194}
}RIS
TY - JOUR TI - Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys AU - Wenchao Yang AU - Jidong Li AU - Yitai Li AU - Junli Feng AU - Jingwu Wu AU - Xiankun Zhou AU - Aihua Yu AU - Jiahui Wang AU - Siyu Liang AU - Mei Wei AU - Yongzhong Zhan PY - 2019 JO - Materials DO - 10.3390/ma12071194 UR - https://doi.org/10.3390/ma12071194 ER -
APA
Yang, W., Li, J., Li, Y., Feng, J., Wu, J., Zhou, X., Yu, A., Wang, J., Liang, S., Wei, M., & Zhan, Y. (2019). Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys. Materials. https://doi.org/10.3390/ma12071194
Source records
- crossref · retrieved 2026-09-27T03:37:22.408Z