Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.

Chen J, Liu B, Hu M, Huang S, Yu S, Wu Y, Yang J

DOI: 10.3390/ma16093504
Published: 2023 May 2
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma16093504,
  title = {Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.},
  author = {Chen J and Liu B and Hu M and Huang S and Yu S and Wu Y and Yang J},
  year = {2023},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma16093504},
  url = {https://doi.org/10.3390/ma16093504}
}

RIS

TY  - JOUR
TI  - Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.
AU  - Chen J
AU  - Liu B
AU  - Hu M
AU  - Huang S
AU  - Yu S
AU  - Wu Y
AU  - Yang J
PY  - 2023
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma16093504
UR  - https://doi.org/10.3390/ma16093504
ER  -

APA

J, C., B, L., M, H., S, H., S, Y., Y, W., & J, Y. (2023). Study of the Solder Characteristics of IGBT Modules Based on Thermal-Mechanical Coupling Simulation.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma16093504

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pubmed · retrieved 2026-09-26T00:47:44.077Z