Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding.

Bahanan W, Fatimah S, Song H, Lee EH, Kim DJ, Yang HW, Woo CH, Ryu J, Widiantara IP, Ko YG

DOI: 10.3390/ma16155252
Published: 2023 Jul 26
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma16155252,
  title = {Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding.},
  author = {Bahanan W and Fatimah S and Song H and Lee EH and Kim DJ and Yang HW and Woo CH and Ryu J and Widiantara IP and Ko YG},
  year = {2023},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma16155252},
  url = {https://doi.org/10.3390/ma16155252}
}

RIS

TY  - JOUR
TI  - Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding.
AU  - Bahanan W
AU  - Fatimah S
AU  - Song H
AU  - Lee EH
AU  - Kim DJ
AU  - Yang HW
AU  - Woo CH
AU  - Ryu J
AU  - Widiantara IP
AU  - Ko YG
PY  - 2023
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma16155252
UR  - https://doi.org/10.3390/ma16155252
ER  -

APA

W, B., S, F., H, S., EH, L., DJ, K., HW, Y., CH, W., J, R., IP, W., & YG, K. (2023). Moldflow Simulation and Characterization of Pure Copper Fabricated via Metal Injection Molding.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma16155252

Source records

pubmed · retrieved 2026-09-26T17:41:05.076Z