Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone
- DOI
- 10.3390/ma17010219
- Published
- 2023-12-30
- Container
- Materials
- Publisher
- MDPI AG
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.3390/ma17010219,
title = {Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone},
author = {Magdalena Lisińska and Tomasz Wojtal and Mariola Saternus and Joanna Willner and Martyna Rzelewska-Piekut and Krzysztof Nowacki},
year = {2023},
journal = {Materials},
doi = {10.3390/ma17010219},
url = {https://doi.org/10.3390/ma17010219}
}RIS
TY - JOUR TI - Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone AU - Magdalena Lisińska AU - Tomasz Wojtal AU - Mariola Saternus AU - Joanna Willner AU - Martyna Rzelewska-Piekut AU - Krzysztof Nowacki PY - 2023 JO - Materials DO - 10.3390/ma17010219 UR - https://doi.org/10.3390/ma17010219 ER -
APA
Lisińska, M., Wojtal, T., Saternus, M., Willner, J., Rzelewska-Piekut, M., & Nowacki, K. (2023). Two-Stage Leaching of PCBs Using Sulfuric and Nitric Acid with the Addition of Hydrogen Peroxide and Ozone. Materials. https://doi.org/10.3390/ma17010219
Source records
- crossref · retrieved 2026-09-25T02:10:01.765Z