Current Characteristics of REBCO Tapes in 6-Slot TSTC-CICC Under Bending Conditions

Li Li, Mingzhen Yang, Songzhen Yuan, Shaotao Dai, Tao Ma

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DOI: 10.3390/ma18020350
Published: 2025-01-14
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma18020350,
  title = {Current Characteristics of REBCO Tapes in 6-Slot TSTC-CICC Under Bending Conditions},
  author = {Li Li and Mingzhen Yang and Songzhen Yuan and Shaotao Dai and Tao Ma},
  year = {2025},
  journal = {Materials},
  doi = {10.3390/ma18020350},
  url = {https://doi.org/10.3390/ma18020350}
}

RIS

TY  - JOUR
TI  - Current Characteristics of REBCO Tapes in 6-Slot TSTC-CICC Under Bending Conditions
AU  - Li Li
AU  - Mingzhen Yang
AU  - Songzhen Yuan
AU  - Shaotao Dai
AU  - Tao Ma
PY  - 2025
JO  - Materials
DO  - 10.3390/ma18020350
UR  - https://doi.org/10.3390/ma18020350
ER  -

APA

Li, L., Yang, M., Yuan, S., Dai, S., & Ma, T. (2025). Current Characteristics of REBCO Tapes in 6-Slot TSTC-CICC Under Bending Conditions. Materials. https://doi.org/10.3390/ma18020350

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crossref · retrieved 2026-11-10T08:58:12.340Z