Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review.

Choi H, Illés B, Dušek K

DOI: 10.3390/ma18051130
Published: 2025 Mar 2
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18051130,
  title = {Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review.},
  author = {Choi H and Illés B and Dušek K},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18051130},
  url = {https://doi.org/10.3390/ma18051130}
}

RIS

TY  - JOUR
TI  - Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review.
AU  - Choi H
AU  - Illés B
AU  - Dušek K
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18051130
UR  - https://doi.org/10.3390/ma18051130
ER  -

APA

H, C., B, I., & K, D. (2025). Sn Whisker Growth Mitigation by Modifying the Composition of the Solder Alloys: A Brief Review.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18051130

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pubmed · retrieved 2026-09-25T23:29:34.775Z