Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).

Han SE, Choi DG, Han S, Lee TY, Han DG, Lee HJ, Yoo S

DOI: 10.3390/ma18081834
Published: 2025 Apr 16
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18081834,
  title = {Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).},
  author = {Han SE and Choi DG and Han S and Lee TY and Han DG and Lee HJ and Yoo S},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18081834},
  url = {https://doi.org/10.3390/ma18081834}
}

RIS

TY  - JOUR
TI  - Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).
AU  - Han SE
AU  - Choi DG
AU  - Han S
AU  - Lee TY
AU  - Han DG
AU  - Lee HJ
AU  - Yoo S
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18081834
UR  - https://doi.org/10.3390/ma18081834
ER  -

APA

SE, H., DG, C., S, H., TY, L., DG, H., HJ, L., & S, Y. (2025). Microstructural and Mechanical Characterization of Cu/SnAg Pillar Bumps with Ni-Less Surface Finish Utilizing Laser-Assisted Bonding (LAB).. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18081834

Source records

pubmed · retrieved 2026-09-25T04:16:49.685Z