Soldering and Bonding in Contemporary Electronic Device Packaging.

Li Y, Pan B, Ge Z, Chen P, Bi B, Yi X, Wu C, Wang C

DOI: 10.3390/ma18092015
Published: 2025 Apr 29
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18092015,
  title = {Soldering and Bonding in Contemporary Electronic Device Packaging.},
  author = {Li Y and Pan B and Ge Z and Chen P and Bi B and Yi X and Wu C and Wang C},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18092015},
  url = {https://doi.org/10.3390/ma18092015}
}

RIS

TY  - JOUR
TI  - Soldering and Bonding in Contemporary Electronic Device Packaging.
AU  - Li Y
AU  - Pan B
AU  - Ge Z
AU  - Chen P
AU  - Bi B
AU  - Yi X
AU  - Wu C
AU  - Wang C
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18092015
UR  - https://doi.org/10.3390/ma18092015
ER  -

APA

Y, L., B, P., Z, G., P, C., B, B., X, Y., C, W., & C, W. (2025). Soldering and Bonding in Contemporary Electronic Device Packaging.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18092015

Source records

pubmed · retrieved 2026-09-26T02:54:48.774Z
europe-pmc · retrieved 2026-09-26T02:54:48.761Z