Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.

Wang CH, Li YH

DOI: 10.3390/ma18102379
Published: 2025 May 20
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18102379,
  title = {Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.},
  author = {Wang CH and Li YH},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18102379},
  url = {https://doi.org/10.3390/ma18102379}
}

RIS

TY  - JOUR
TI  - Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.
AU  - Wang CH
AU  - Li YH
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18102379
UR  - https://doi.org/10.3390/ma18102379
ER  -

APA

CH, W., & YH, L. (2025). Liquid-State Interfacial Reactions of Lead-Free Solders with FeCoNiCr and FeCoNiMn Medium-Entropy Alloys at 250 °C.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18102379

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pubmed · retrieved 2026-09-26T20:36:03.281Z