Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish.

Jeyeselan L, Mhd Noor EE

DOI: 10.3390/ma18163722
Published: 2025 Aug 8
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18163722,
  title = {Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish.},
  author = {Jeyeselan L and Mhd Noor EE},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18163722},
  url = {https://doi.org/10.3390/ma18163722}
}

RIS

TY  - JOUR
TI  - Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish.
AU  - Jeyeselan L
AU  - Mhd Noor EE
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18163722
UR  - https://doi.org/10.3390/ma18163722
ER  -

APA

L, J., & EE, M. N. (2025). Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18163722

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pubmed · retrieved 2026-09-26T17:05:51.063Z
europe-pmc · retrieved 2026-09-26T17:05:51.078Z