In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.

Nogita K, Tan XF, Zhou J, McDonald SD, Sweatman K, Somidin F, Zeng G, Maeno H, Yasuda K, Gourlay CM

DOI: 10.3390/ma18163925
Published: 2025 Aug 21
Container: Materials (Basel, Switzerland)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma18163925,
  title = {In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.},
  author = {Nogita K and Tan XF and Zhou J and McDonald SD and Sweatman K and Somidin F and Zeng G and Maeno H and Yasuda K and Gourlay CM},
  year = {2025},
  journal = {Materials (Basel, Switzerland)},
  doi = {10.3390/ma18163925},
  url = {https://doi.org/10.3390/ma18163925}
}

RIS

TY  - JOUR
TI  - In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.
AU  - Nogita K
AU  - Tan XF
AU  - Zhou J
AU  - McDonald SD
AU  - Sweatman K
AU  - Somidin F
AU  - Zeng G
AU  - Maeno H
AU  - Yasuda K
AU  - Gourlay CM
PY  - 2025
JO  - Materials (Basel, Switzerland)
DO  - 10.3390/ma18163925
UR  - https://doi.org/10.3390/ma18163925
ER  -

APA

K, N., XF, T., J, Z., SD, M., K, S., F, S., G, Z., H, M., K, Y., & CM, G. (2025). In Situ Observation of Deformation in a Sn-3Ag-0.5Cu/Cu Solder Joint Using High-Voltage Transmission Electron Microscopy.. Materials (Basel, Switzerland). https://doi.org/10.3390/ma18163925

Source records

pubmed · retrieved 2026-09-27T12:25:04.143Z