Enhancing Electromigration Lifetime Through Controlled Reduction of Bismuth Content in Sn-Bi-Ag Solder Interconnects

Shengbo Wang, Shuai Meng, Houlin Liu, Mingliang Huang

Open source

DOI: 10.3390/ma18245672
Published: 2025-12-17
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma18245672,
  title = {Enhancing Electromigration Lifetime Through Controlled Reduction of Bismuth Content in Sn-Bi-Ag Solder Interconnects},
  author = {Shengbo Wang and Shuai Meng and Houlin Liu and Mingliang Huang},
  year = {2025},
  journal = {Materials},
  doi = {10.3390/ma18245672},
  url = {https://doi.org/10.3390/ma18245672}
}

RIS

TY  - JOUR
TI  - Enhancing Electromigration Lifetime Through Controlled Reduction of Bismuth Content in Sn-Bi-Ag Solder Interconnects
AU  - Shengbo Wang
AU  - Shuai Meng
AU  - Houlin Liu
AU  - Mingliang Huang
PY  - 2025
JO  - Materials
DO  - 10.3390/ma18245672
UR  - https://doi.org/10.3390/ma18245672
ER  -

APA

Wang, S., Meng, S., Liu, H., & Huang, M. (2025). Enhancing Electromigration Lifetime Through Controlled Reduction of Bismuth Content in Sn-Bi-Ag Solder Interconnects. Materials. https://doi.org/10.3390/ma18245672

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crossref · retrieved 2026-09-26T01:18:09.618Z