Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages

Junchen Liu, Abdullah Aziz Saad, Yuezong Zheng, Hongchao Ji, Zuraihana Bachok

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DOI: 10.3390/ma19030636
Published: 2026-02-06
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19030636,
  title = {Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages},
  author = {Junchen Liu and Abdullah Aziz Saad and Yuezong Zheng and Hongchao Ji and Zuraihana Bachok},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19030636},
  url = {https://doi.org/10.3390/ma19030636}
}

RIS

TY  - JOUR
TI  - Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages
AU  - Junchen Liu
AU  - Abdullah Aziz Saad
AU  - Yuezong Zheng
AU  - Hongchao Ji
AU  - Zuraihana Bachok
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19030636
UR  - https://doi.org/10.3390/ma19030636
ER  -

APA

Liu, J., Saad, A. A., Zheng, Y., Ji, H., & Bachok, Z. (2026). Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages. Materials. https://doi.org/10.3390/ma19030636

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crossref · retrieved 2026-09-26T01:17:52.342Z