Effect of Internal Curing on Early Shrinkage and Crack Resistance of UHPC by SAP and Ceramsite

Xianqiang Wang, Jinxu Wang, Xiaonan Feng, Zaixin Yang, Jiancheng Gu, Wenqin Deng

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DOI: 10.3390/ma19040806
Published: 2026-02-20
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19040806,
  title = {Effect of Internal Curing on Early Shrinkage and Crack Resistance of UHPC by SAP and Ceramsite},
  author = {Xianqiang Wang and Jinxu Wang and Xiaonan Feng and Zaixin Yang and Jiancheng Gu and Wenqin Deng},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19040806},
  url = {https://doi.org/10.3390/ma19040806}
}

RIS

TY  - JOUR
TI  - Effect of Internal Curing on Early Shrinkage and Crack Resistance of UHPC by SAP and Ceramsite
AU  - Xianqiang Wang
AU  - Jinxu Wang
AU  - Xiaonan Feng
AU  - Zaixin Yang
AU  - Jiancheng Gu
AU  - Wenqin Deng
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19040806
UR  - https://doi.org/10.3390/ma19040806
ER  -

APA

Wang, X., Wang, J., Feng, X., Yang, Z., Gu, J., & Deng, W. (2026). Effect of Internal Curing on Early Shrinkage and Crack Resistance of UHPC by SAP and Ceramsite. Materials. https://doi.org/10.3390/ma19040806

Source records

crossref · retrieved 2026-09-25T00:33:44.865Z