Visible–Infrared Dual-Modal Monitoring System for Overlap Defects in Wire Arc Additive Manufacturing

Weixin Wang, Peng Gao, Dongli Chen, Runzhen Yu, Hongwei Kang, Zhuang Zhao

Open source

DOI: 10.3390/ma19050899
Published: 2026-02-27
Container: Materials
Publisher: MDPI AG
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.3390/ma19050899,
  title = {Visible–Infrared Dual-Modal Monitoring System for Overlap Defects in Wire Arc Additive Manufacturing},
  author = {Weixin Wang and Peng Gao and Dongli Chen and Runzhen Yu and Hongwei Kang and Zhuang Zhao},
  year = {2026},
  journal = {Materials},
  doi = {10.3390/ma19050899},
  url = {https://doi.org/10.3390/ma19050899}
}

RIS

TY  - JOUR
TI  - Visible–Infrared Dual-Modal Monitoring System for Overlap Defects in Wire Arc Additive Manufacturing
AU  - Weixin Wang
AU  - Peng Gao
AU  - Dongli Chen
AU  - Runzhen Yu
AU  - Hongwei Kang
AU  - Zhuang Zhao
PY  - 2026
JO  - Materials
DO  - 10.3390/ma19050899
UR  - https://doi.org/10.3390/ma19050899
ER  -

APA

Wang, W., Gao, P., Chen, D., Yu, R., Kang, H., & Zhao, Z. (2026). Visible–Infrared Dual-Modal Monitoring System for Overlap Defects in Wire Arc Additive Manufacturing. Materials. https://doi.org/10.3390/ma19050899

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crossref · retrieved 2026-11-05T13:16:16.060Z