Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight.

Zhang X, Gao J, Zhang L.

DOI: 10.3390/ma19071418
Published: 2026-04-02
Container: Materials (Basel)
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.3390/ma19071418,
  title = {Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight.},
  author = {Zhang X and  Gao J and  Zhang L.},
  year = {2026},
  journal = {Materials (Basel)},
  doi = {10.3390/ma19071418},
  url = {https://doi.org/10.3390/ma19071418}
}

RIS

TY  - JOUR
TI  - Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight.
AU  - Zhang X
AU  -  Gao J
AU  -  Zhang L.
PY  - 2026
JO  - Materials (Basel)
DO  - 10.3390/ma19071418
UR  - https://doi.org/10.3390/ma19071418
ER  -

APA

X, Z., J, G., & L., Z. (2026). Strengthening Copper Nano-Solder Pastes with Group IV 2D Materials: A Molecular Dynamics Insight.. Materials (Basel). https://doi.org/10.3390/ma19071418

Source records

europe-pmc · retrieved 2026-09-26T01:18:23.150Z